KL20
@ Penang 2026

Discover Exchange Zone

An interactive innovation that showcases the full spectrum of Malaysia's semiconductor & digital ecosystem 🚀 Startup Alley Meet tomorrow's innovators. 🏭 Innovation Showcase Experience the technologies shaping the future. ⚙️ Live Tech Demos on mini stage See innovation in action.

Semiconductor Discovery Quest

An interactive passport challenge where students explore the event by completing missions, engaging with industry professionals and discovering technologies across Malaysia's semiconductor ecosystem.

Exchange Opening Experience

Opening Welcome by the Master of Ceremony

Shaping Malaysia’s Next Semiconductor Chapter

As Malaysia advances its semiconductor ambitions, this leadership conversation explores how the country can strengthen innovation, technology capabilities and globally competitive local companies. The discussion will focus on policies, strategies, and vision, and on how investment, talent, commercialisation, and industry collaboration can help Malaysian companies move up the value chain and compete globally. The session will conclude with special announcements and an MoU/MoC signing ceremony, supporting the next phase of Malaysia’s semiconductor and technology ambitions.

Moderator

Dato' Seri Loo Lee Lian

InvestPenang

Speaker

YB Tuan Haji Akmal Nasrullah bin Mohd Nasir

Ministry of Economy

Speaker

YAB Tuan Chow Kon Yeow

Penang State Government

Speaker

Nicholas Khaw

Khazanah Nasional

Accelerating Industry-Ready Talent

An industry-led platform bridging academia and industry by equipping students and graduates with industry-relevant technology skills and practical exposure. The segment highlights how NCIA’s Industry-Driven Technology Module (IDTM) supports the development of industry-ready talent and future technology entrepreneurs through targeted elective programmes and pathways into industry and entrepreneurship.

Strategic Announcement and MOU/ MOC Exchange

Global Leadership Insights | When AI Broke the Box: Silicon, Systems, and What Engineering Becomes After the Box Breaks

Artificial intelligence is reshaping far more than software. It is changing the way computing systems are designed from the ground up. As AI drives unprecedented demands on compute, memory, connectivity, power, cooling and advanced packaging, the traditional boundaries between chip and system are beginning to disappear. Increasingly, the unit of design is no longer simply the silicon, but the entire system built around the workload. At the same time, AI is beginning to transform how engineering itself is done. Semiconductor development has traditionally been divided across architecture, RTL, verification, physical design, packaging, firmware and validation. AI creates the opportunity to connect these disciplines, accelerate learning across the engineering lifecycle and rethink how complex systems are designed, validated and brought to market. Drawing on nearly three decades of semiconductor and systems engineering, including many years working closely with engineering teams in Penang, Jay Kirkland explores what happens when AI breaks both of these “boxes” — the boundaries of the computing system and the boundaries within engineering itself. The session will examine why the next competitive advantage may come not only from building better silicon, but from reinventing the engineering model behind it — and what this shift could mean for Penang and Malaysia’s next chapter in the global semiconductor industry.

Speaker

Jay Kirkland

Marvell Technology

Global Leadership Insights | Embedded Intelligence: Creating the Next Wave of Semiconductor Innovation

As intelligence moves closer to where data is generated, advances in embedded processing and Edge AI are enabling faster, smarter and more energy-efficient systems. This keynote explores how embedded intelligence, connectivity and sensing are creating new opportunities for semiconductor innovation across industrial, automotive and IoT applications, while enabling the next generation of smart products and intelligent systems.

Speaker

Srikanth Settikere

Microchip Technology

Industry Exchange | Engineering the Next Generation of AI Chips: EDA, Silicon IP & Foundry Ecosystems

The growing complexity of AI systems is transforming how semiconductors are designed, verified and brought to market. This session brings together leaders from EDA, silicon IP, foundry and chip design to explore how advanced design tools, reusable IP, foundry enablement and ecosystem collaboration are accelerating the development and commercialisation of next-generation AI chips.

Moderator

Teh J-Wing

Advanced Micro Devices (AMD)

Speaker

Dato' Fong Swee Kiang

SkyeChip

Speaker

James Ng

Synopsys

Speaker

Lee Wei Chern

Intel Technology

Speaker

MJ Lai

Cadence Design Systems

Speaker

Tindaro Danze

Siemens Malaysia

Industry Exchange | Accelerating Semiconductor Innovation Through Industry Collaboration From Partnerships to Capability, Customers and Scale

As the semiconductor industry becomes more complex and globally interconnected, collaboration across the value chain is increasingly critical to turning innovation into commercial outcomes. This session brings together multinational corporations, Malaysian industry and ecosystem leaders to explore how partnerships can accelerate technology adoption, develop local suppliers, open access to customers and manufacturing opportunities, and build globally competitive capabilities within Malaysia’s semiconductor ecosystem.

Moderator

Dato' Dr. Hari Narayanan

Penang Skills Development Centre (PSDC)

Speaker

Dato' Seri Tan Eng Kee

Greatech Integration

Speaker

Ng Kok Tiong

Infineon Technologies

Speaker

Professor Matthew Maynard

University of Strathclyde

Speaker

Sayron Ruiz González

Dexcom

Speaker

Yap Suan See

Advanced Technologies & Solutions (AT&S)

Malaysia's Semiconductor Champions: Inspiring the Next Generation

Malaysia has built a generation of globally competitive semiconductor companies across the value chain. Bringing together leaders from these industry champions, this conversation looks behind their growth journeys — the strategic choices, leadership decisions and investments that enabled them to build globally competitive businesses — and the lessons they can share with the next generation of Malaysian semiconductor and technology companies.

Moderator

Kayse Foo

Khazanah Nasional

Speaker

Dato' Chu Jenn Weng

ViTrox Corporation Berhad

Speaker

Lau Kean Cheong

INARI AMERTRON

Speaker

Manuel Zarauza

Malaysian Pacific Industries

Speaker

Tan Chun Chiat

Oppstar

Engineering the Infrastructure for AI at Scale

As AI workloads grow in scale and complexity, delivering performance increasingly depends on how compute, networking, storage and cloud infrastructure are engineered as one system. This conversation explores the infrastructure required to train, deploy and run AI at scale — from accelerated computing and high-performance networking to cloud architecture, workload orchestration and enterprise deployment. The speakers will examine where infrastructure bottlenecks are emerging and how different layers must work together to deliver AI efficiently, reliably and at scale.

Moderator

Ts. Jaffri Ibrahim

CREST

Speaker

Chan Kee Siak

Exabytes

Speaker

Thum Siew Beng

Microsoft

Beyond the Degree: Skills That Matter Most

A casual live conversation exploring the skills, mindsets and experiences young talent need to thrive in the future technology economy. The session looks at how AI and emerging technologies are reshaping careers, what employers value beyond academic qualifications, and how students can prepare themselves to become the next generation of engineers, innovators and technology leaders in Malaysia’s semiconductor and digital economy.

Speaker

Isaac Calvin A/L Silvester

Emerson NI

Startup Masterclass | Learn from Those Who've Been There.

Kick-start your entrepreneurial journey with an interactive mentoring session featuring successful founders, venture capital investors and industry leaders. Gain practical insights into building and scaling technology ventures, crafting compelling pitches, attracting investors and navigating the startup ecosystem. Through engaging sharing sessions and audience Q&A, participants will receive practical advice, real-world perspectives and valuable inspiration to accelerate their innovation journey.

Speaker

Han Jun Siew

Independent

Connect with the right partners. Unlock new opportunities.

Pre-arranged one-to-one meetings designed to connect startups with MNCs, investors and ecosystem partners to explore technology collaborations, pilot projects, customer opportunities, strategic partnerships and investment opportunities.

Beanbag Chats with Tech Professionals & Engineers

An informal, small-group engagement connecting students with engineers, technology professionals and startup builders from across the semiconductor value chain. Participants will gain first-hand insights into real projects, day-to-day roles and career journeys, while exploring pathways across Chip Design, Manufacturing, Advanced Packaging, Test & Measurement, Automation, AI & Software, and Semiconductor Startups.

Speaker

Avenous Lee Chee Wen

Sophic Automation

Speaker

Isaac Calvin A/L Silvester

Emerson NI

Speaker

Lee Yi Dong

Coherent

Speaker

Manojkumar Subramaniam

ECTrons

Speaker

Nur Syahira Yusra Bt. Md Samsuddin

Advanced Micro Devices (AMD)

Startup Pitch Showcase

Selected startups will take the stage to present their breakthrough technologies and innovative solutions to an audience of MNCs, investors, venture capital firms and industry leaders. Each startup will deliver a concise pitch followed by a brief Q&A, providing an opportunity to showcase their innovation, receive valuable feedback and spark conversations that can lead to strategic partnerships, customer opportunities and investment.

Silicon Showdown: Custom AI Silicon vs. GPUs: Who Wins the Next Era of AI?

The race for AI performance is forcing technology companies to make a fundamental architecture choice: rely on general-purpose GPU acceleration or build silicon optimised for specific workloads? Through an interactive technology debate, this session examines where GPUs retain their advantages in flexibility, programmability and scale, where custom AI silicon can deliver gains in performance, power efficiency and economics, and how engineers should decide which architecture best fits a particular AI workload.

Speaker

Ben Oon

Advanced Micro Devices (AMD)

Speaker

Matthew Khaw

Amazon Web Services

Speaker

Teh Chee Hak

SkyeChip

Capital Connect | Why Do Investors Bet on Semiconductor Companies?

What makes investors back a semiconductor company? This conversation brings together regional investors to examine what capital looks for across technology differentiation, defensible IP, product validation, customer traction, team capability and scalability. The discussion will explore how investors assess opportunities and risks in semiconductor ventures, what makes a company investment-ready, and what Malaysian semiconductor companies need to strengthen to attract capital and scale globally.

Moderator

Lim Li Lian

Khazanah

Speaker

Akmal Mokhtar

CW Crescent Tech Fund

Speaker

Joseph Chan

AppWorks

Speaker

Kenny Kim

Ikhlas Capital

Speaker

Pang Chan Yip

Vertex Ventures SEA & India

Speaker

Woo Chung Hee

InterVest

Advanced Packaging for AI | Heterogeneous Integration & Chiplet Architectures

As AI systems demand greater compute density, memory bandwidth and energy efficiency, packaging is becoming a critical part of system performance. This conversation examines how chiplets, high-bandwidth memory and heterogeneous components are being integrated through advanced 2.5D and 3D packaging. The speakers will explore the engineering challenges around die-to-die connectivity, interconnect density, thermal management, power delivery, yield and manufacturability — and what it will take to bring increasingly complex multi-die AI systems into production.

Speaker

Andrew Kang

Siliconware Precision Industries

Speaker

Dr. Eu Poh Leng

NXP Semiconductor Malaysia

Speaker

Qian Xiao Qing

China Wafer Level CSP

Founders Conversations | Building and Scaling Malaysia's Next IC Design Champions

Malaysia’s growing semiconductor design ecosystem is creating new opportunities to turn engineering expertise into proprietary IP and products. This conversation examines what it takes to build competitive design teams, develop differentiated technologies, achieve product validation, secure early customers and scale Malaysian designed solutions into global markets.

Moderator

Kamarul Zaman Abdul Rashid

Altera Semiconductor Technology

Speaker

Dr. Wong Peng Wen

FILPAL

Speaker

Kalai Selvan Subramaniam

Infinecs Systems

Speaker

Ng Meng Wah

SiliconX

Speaker

Ong Chin Hu

GreatAsic Technology

Innovation Sprint

A fast-paced, pre-registered team challenge where students work in teams of 5–7 to tackle real industry challenges presented by participating companies. Guided by industry mentors, each team will have 60 minutes to develop an innovative solution before delivering a 5-minute pitch to a panel of industry judges. The Innovation Sprint allows students to apply their technical knowledge, creativity and problem-solving skills in a real-world setting, while gaining exposure to innovation, entrepreneurship and industry collaboration. The session concludes with the announcement of the winning teams and the presentation of the Grand Prize, runner-up awards and special recognitions.

Speaker

Janniece Loh Paik Hoe

Sophic Automation Sdn Bhd

AI-Driven Semiconductor Manufacturing | Engineering the Autonomous Factory

What happens when semiconductor manufacturing can predict problems, optimise processes and make decisions increasingly in real time? This conversation explores how AI, automation, advanced analytics and manufacturing intelligence are transforming semiconductor operations — from connected factories and remote engineering to increasingly autonomous production. Drawing on real-world manufacturing experience, the speakers will examine what is already possible today, where human engineering judgement remains critical, and what still needs to change before truly autonomous semiconductor manufacturing becomes a reality.

Speaker

Dato' Bock Kim Lee

Sandisk

Founder Conversations | Building and Scaling Malaysia's Next Advanced Packaging Champions

As advanced packaging becomes increasingly critical to semiconductor performance and system integration, new opportunities are emerging for Malaysian companies to build differentiated technologies and capabilities. This conversation focuses on the journey from technology development and qualification to customer adoption, manufacturing scale and global market expansion — and what it takes to build competitive Malaysian advanced packaging companies.

Moderator

Rosazizan Bin Rosli

Malaysia Technology Development Corporation

Speaker

Dr. YT Chin

Silicon Connect

Speaker

Ooi Teng Chow

FusionAP

Speaker

Teo Chee Kheong

Mi Equipment

Networking/ Transition

Engineering the Next Era of AI

Building the next generation of AI silicon requires engineers to translate rapidly growing compute demands into increasingly complex, production ready designs. This Tech Talk explores the engineering challenges behind advanced AI silicon — from IP and SoC integration to performance, power and area optimisation, design verification and silicon validation. The session examines how engineering teams manage increasing design complexity while delivering the performance, efficiency and reliability required for the next generation of AI computing.

Speaker

Teh J-Wing

Advanced Micro Devices (AMD)

Business Matching

Connect with the right partners. Unlock new opportunities. Pre-arranged one-to-one meetings designed to connect startups with MNCs, investors and ecosystem partners to explore technology collaborations, pilot projects, customer opportunities, strategic partnerships and investment opportunities.

Founder Conversations | Building and Scaling Malaysia's Next Semiconductor Equipment & Technology Champions

Malaysia has built a strong foundation in semiconductor equipment, automation and engineering solutions. This conversation explores how homegrown companies are developing proprietary technologies, securing first-customer adoption, strengthening product capabilities and expanding from Malaysia’s semiconductor ecosystem into global markets.

Moderator

Dato' Seri Lee Kah Choon

Northeast Group Berhad

Speaker

Dato' Ts. Dr. Shanmuganathan Palanisamy

ECTrons

Speaker

Hawke Tan

UB Group

Speaker

Koh Dim Kuan

Sophic Automation

Speaker

Ng Chin Wah

Aemulus

Featured Tech Leadership Insight | Securing AI at Scale — Identity, Access & Operational Resilience

As AI moves from experimentation into business critical environments, securing who and what can access models, applications and sensitive data becomes increasingly important. This Tech Leadership Insight examines the security foundations required for enterprise AI — from identity and access management to cybersecurity, governance, risk and operational resilience. Drawing on experience across enterprise IT and security environments, the session explores how organisations can scale AI while maintaining control, protecting critical systems and building trust into increasingly AI-enabled operations.

Speaker

Balasubramanian Ramaiah

ISSQUARED

From AI Compute to Scientific Discovery | Agentic AI in Action

A live demonstration of how GPU-accelerated computing and agentic AI are enabling high-value scientific applications. M3TRIQ will showcase an integrated molecular discovery workflow in which specialised AI models and tools coordinate protein structure prediction, molecular docking, generative design, prioritisation, and analysis. The session highlights how advances in AI compute, high-performance infrastructure, and intelligent orchestration can turn complex scientific processes into faster, more scalable, and deployable innovation—connecting Malaysia’s growing technology capabilities to opportunities in biotechnology, advanced manufacturing, and the digital economy

Global Partnership | Malaysia–Japan Partnerships to Scale the Next Generation of Semiconductor Innovation

As Malaysia develops its next generation of semiconductor champions, global partnerships will be critical to helping companies access technology, investment, talent, customers and international markets. Focusing on the growing Malaysia–Japan relationship, this closing conversation explores how cross-border collaboration can strengthen industry capabilities, accelerate technology development, open new market opportunities and support companies from both countries in scaling globally.

Moderator

Dato' Dr. Yuma Kohishi

Texchem Resources

Speaker

Katsuhiko Hayashi

IBIDEN Electronics Malaysia

Speaker

Ong Mee Choo

InvestPenang

Speaker

Shoichi Ohori

TOPPAN Technical Design Center Inc.

Closing Tech Outlook | Beyond the Roadmap — What Comes Next for Semiconductors?

What technologies could define the semiconductor industry beyond today’s AI compute roadmap? This closing outlook looks ahead to emerging technologies including silicon photonics, co packaged optics, optical I/O, next-generation power technologies, new materials and emerging device architectures. The session will examine which technologies are moving closer to commercial adoption, the technical and ecosystem barriers that remain, and where the next major shifts in semiconductor technology and markets could emerge.

Speaker

Calvin Yong

Yole Group